The Institute of Scientific and Industrial Research, Osaka University

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HOME > Research Introduction > Division of Advanced Materials and Beam Science > Department of Advanced Interconnection Materials

Department of Advanced Interconnection Materials

Staff

  • Photo
    Prof.
    K. SUGANUMA
  • Photo
    Assoc. Prof.
    S. NAGAO
  • Photo
    Assis. Prof.
    T. SUGAHARA
  • Photo
    Specially Appointed Assis. Prof.
    H. ZHANG
  • Photo
    Specially Appointed Assis. Prof.
    C. CHEN
  • Photo
    Specially Appointed Assis. Prof.
    Z. LI

Content of research

Through nanotechnology and nanoscience with advanced analytical techniques, this laboratory aims to develop the fine structural materials and components, which can be applied in the industrial fields of electronics, automobiles and natural energy conversion systems. In addition, we try to establish new interdisciplinary research areas that require the harmonized multi-material systems.

Current Research Programs

  1. 1. Development of die-bonding method of power electronics
  2. 2. Tin Whisker mechanism
  3. 3. Development of conductive adhesives and research on their conductive mechanism
  4. 4. Electromigration
  5. 5. Printed Electronics
  6. 6. Preparation and application of nano materials

Figure / Graph

  • Fig.1

VIDEO INTRODUCTION

The Institute of Scientific and Industrial Research, Osaka University

contact home japanese
HOME > Research Introduction > Division of Advanced Materials and Beam Science > Department of Advanced Interconnection Materials

Department of Advanced Interconnection Materials

Staff

  • Photo
    Prof.
    K. SUGANUMA
  • Photo
    Assoc. Prof.
    S. NAGAO
  • Photo
    Assis. Prof.
    T. SUGAHARA
  • Photo
    Specially Appointed Assis. Prof.
    H. ZHANG
  • Photo
    Specially Appointed Assis. Prof.
    C. CHEN
  • Photo
    Specially Appointed Assis. Prof.
    Z. LI

Content of research

Through nanotechnology and nanoscience with advanced analytical techniques, this laboratory aims to develop the fine structural materials and components, which can be applied in the industrial fields of electronics, automobiles and natural energy conversion systems. In addition, we try to establish new interdisciplinary research areas that require the harmonized multi-material systems.

Current Research Programs

  1. 1. Development of die-bonding method of power electronics
  2. 2. Tin Whisker mechanism
  3. 3. Development of conductive adhesives and research on their conductive mechanism
  4. 4. Electromigration
  5. 5. Printed Electronics
  6. 6. Preparation and application of nano materials

Figure / Graph

  • Fig.1

VIDEO INTRODUCTION