In this workshop, we utilize semiconductor microfabrication technology to produce and develop experimental materials and microdevices.
Name | External View | Description | Usage Fee (JPY/hour) |
---|---|---|---|
LED lithography (Maskless lithograpy) | ![]() |
Exposure using a high-intensity 365 nm LED, Maximum patterning area: 100 mm × 100 mm, Minimum dot size: about 1 µm × 1 µm. |
1,000 | Mask Aligner | ![]() |
Mask window size: 4cm x 4cm. | 1,000 |
Pulsed Laser Deposition | ![]() |
ArF laser (193nm), Oxigen Gas. | 12,000 |
Reactive Ion Etching | ![]() |
SF6, CHF3, and O2 gases are available. | 1,000 |
Thermal evaporation system | ![]() |
Metal films are deposited by resistive heating. | 1,000 |
The image shows examples of fabricated devices from larger to smaller: "Aluminum beam chopper", "Special dark-field observation microscope mirror", "Silicon thin film target", "Nickel evaporation mask", "Membrane protein expression detection device", "Gold wire antenna", "Microdroplet array", "Silicon substrate with grid", "Silicon oxide membrane hollow structure", and "Silicon tapered structure".
Room: S314
Extension: 8433
Email: shouichi@sanken.osaka-u.ac.jp