Our Network Members
Our Network Members
1.Prof. K. Matsumoto and Prof. M. Ogura
Nano-carbon based sensing devices, materials fabrication and device design
2.Prof. K. Suganuma and Prof. S. Nagao
Nanomaterial science in printing electronic circuits on optically transparent soft materials
3.Prof. J. Takeya
Fabrication and physical property measurements of organic semiconductor film for more applicable flexible electronic devices
4.Prof. K. Nakatani and Prof. A. Yamaguchi
Design and synthesis of small ligands that target specific structures in DNA and RNA, and structure-based development of ligands for specific transport proteins
5.Prof. H. Sasai
Organic chemistry for advanced electronics materials
6.Prof. Y.Yagi
Big-deta analysis for safer and securer society
7.Prof. T. Washio and Prof. M. Numao
Data mining and data processing from sensing devices
8.Prof. T. Nagai
Development of novel fluorescent/bioluminescent protein-based sensors for biological events
Oversea Cores
1. University of Oxford
Dr. S. Contera
Carbon NanoTube biosensor and device application
2. Imec
Dr. J. Boeck, Dr. P. Heremans and Dr. S. de Gendt
Function analysis of sensing device
Dr. P. Feumans and Dr. L. Lagae
Sensing circuit fabrication
3. NTNU, Norwegian University of Science and Technology Norway
Prof. Z. Zhang, and Prof. J. He
Mechanical analysis and simulations of nano-particle based electronic materials
4. Max Planck Institute (Mainz)
Prof. P. Blom
Organic semiconductor devices
5. Paris-Sud University
Prof. G. Thanh, Prof. C. Bournaud and Prof. S. Bezzenine
Organic chemistry for organic semiconductors
Purdue University
Prof. D. Janes and Prof. J. Appenzeller
Dynamic-data processing for safety/security
Nagao face photo
Satellite Universities/Institutes
Japanese Core Members at SANKEN, Osaka University
-University of Cambridge
-imec Holst Centre (The Netherlands)
-Drexel University and University of Pennsylvania (USA)
-Alto University (Finland)
-University de Bourgogne, University of Bordeaux, University of Joseph Fourier University and Institute of TELECOM (France)
Our project partners on this project are;
-Research Institute of Electronic Science (RIES) of Hokkaido University,
-Institute of Multidisciplinary Research for Advanced Materials (IMRAM) of Tohoku University,
-Chemical Research Laboratory (CRL) of Tokyo Institute of Technology
-Institute for Materials Chemistry and Engineering (IMCE) of Kyushu University.